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Micro Substrates: Via-Filled Ceramic and Quartz Interconnect Substrates |
Category: Electronics |
| Micro Substrates Corp. manufactures via-filled ceramic and quartz interconnect substrates using semiconductor technology for high frequency packages, thin-film rf and microwave integrated circuits (MIC), MEMS, interconnects, interposers, medical devices, wafer-level semiconductor probe cards, digital single chip, CSP, biotech and other medical applications. |
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