TeleCIS Wireless appointments Clarence Sam Endy as President and CEO



Endy Brings More Than 20 Years of Experience in Advanced Wireless Technologies and Services in Domestic and International Markets


Santa Clara, Calif., -/25 Feb, 2005 - Wi-Fi Technology News/- TeleCIS Wireless, Inc., a leading developer of broadband wireless access (BWA) chipset technology, announced the appointment of Clarence ?Sam? Endy as President and CEO, effective immediately.

Dr. Endy will oversee the company?s strategy to broaden its leading 802.11 WiFi architecture with high performance ?System-on-a-Chip? solutions for 802.16 WiMAX terminal devices in both the fixed and mobile markets. Ultimately, the company plans to deliver a product that combines WiMAX fixed, WiMAX mobile and WiFi protocols in a single ASIC. This multi-protocol product will allow end-users to seamlessly connect to the most appropriate network on an anytime and anywhere basis and provide a compelling solution for WiMAX operators, user terminal device manufacturers and end-customers.

?I am excited to be joining this emerging powerhouse of wireless technology at a time of great interest in and promise for the BWA industry,? said Dr. Endy. ?I am tremendously impressed by the company?s portfolio of revenue-generating IP and the team they have assembled to date, led by Dr. Je Woo Kim, one of the most brilliant minds in the wireless industry. However, promise means nothing without execution and I look forward to helping the company realize its potential by being the first to bridge the Wi-Fi and WiMAX gap in a single ASIC.?

Dr. Endy comes to TeleCIS Wireless from ArrayComm, a world leader in mobile broadband wireless and smart antenna technology, where he served most recently as President and CEO. At ArrayComm, he led teams behind the development and marketing of ArrayComm?s principal products ? the iBurst Personal Broadband system and the IntelliCell smart antenna array processing technology which has been implemented in more than 250,000 base stations worldwide. He also forged technology license partnerships with industry leaders such as Kyocera, LG Electronics, Marconi, Airnet Communications and EADS and, most recently, he oversaw ArrayComm?s smart antenna technology entry into the WiMAX market.

Dr. Endy?s career prior to ArrayComm spans more than 17 years of success in building new wireless and wireline operator businesses. As VP, Operations at Sprint, he was responsible for the activation and operation of Sprint?s 20,000-mile U.S. fiber network, 42 switching centers, and initiation of international service. As SVP Marketing, Sales and Service at Centex Telemanagement, Dr. Endy helped build the industry?s first successful CLEC based on Centrex and helped sell the business to MFS. As EVP and COO of International Wireless, he oversaw the development of 10 wireless mobile cellular, paging and specialized mobile trunked radio companies in Asia and Latin America.

Prior to his work in telecommunications, Dr. Endy had a distinguished leadership career in the U.S. Army in a variety of combat, Pentagon, and academic positions. He left military service as a tenured professor and Deputy Head of Electrical Engineering at the US Military Academy. Dr. Endy is a graduate of the US Military Academy at West Point and earned MS and PhD degrees in Electrical Engineering from Purdue University.

About TeleCIS Wireless

TeleCIS Wireless, Inc. (http://www.telecis.com) is a Silicon Valley-based, fabless semiconductor company dedicated to delivering multi-protocol wireless System-on-a-Chip (SoC) solutions for more efficient Broadband Wireless Communications. Founded in January 2000 to develop chipsets for the WLAN market, the company generates revenue via a rich IP portfolio of performance leading 802.11a/b/g chipsets based on patent-pending wireless and smart antenna technologies. The company is currently developing multi-protocol SoC Broadband Wireless chipsets supporting WiMAX, WiMAX Mobile (future) and WLAN protocols in a single ASIC.