Z-Com Selects TI Wi-Fi and VoIP Solutions for USB Adapters and RG Modules
Z-Com Selects TI Wi-Fi and VoIP Solutions for USB Adapters and RG Modules
Z-Com Selects Texas Instruments Embedded WLAN and Voice over IP Solutions for Next Generation USB Adapters and Residential Gateway Modules
DALLAS and TAIWAN -/June 30, 2005 - Wi-Fi Technology News/- Texas Instruments Incorporated (TI) [NYSE: TXN] announced that Z-Com, a leading global wireless broadband ODM, has selected TI?s Wireless LAN (WLAN) and Voice over IP (VoIP) products for its universal serial bus (USB) adapter and residential gateway (RG) module product lines, enabling consumers to benefit from high quality, integrated broadband data, wireless and voice applications.
Z-Com has developed the XG-750 USB adapter, which plugs into the computer?s USB port to enable seamless wireless connectivity. The product is based on TI?s TNETW1450 WLAN solution which features a compact design and high security and quality of service (QoS) standards. In addition, Z-Com?s RG module incorporates TI?s TNETW1350A solution, which features industry-leading output power enabling extended range operation.
Z-Com has also selected TI?s TNETV1060 VoIP solution for its P-1050 VoIP gateway, the company?s first product targeting the VoIP market. A highly integrated software and silicon system-on-a-chip, TI?s expandable and scalable solution is designed to address the requirements of residential and small office/home office (SOHO) gateways.
?TI is pleased to support Z-Com?s next generation products with industry leading WLAN and VOIP technology. Z-Com is now shipping a highly differentiated bundled solution to enable seamless connectivity throughout the home,? said Dennis Rauschmayer, director of marketing for TI?s Residential Gateway and Embedded Systems group.
TI?s TNETW1450 and TNETW1350A
Earlier this year TI introduced two members of its family of application-specific WLAN solutions. The IEEE 802.11 a/b/g compatible TNETW1450 media access controller (MAC) and baseband (BB) processor enables manufacturers to add wireless functionality to devices with USB 2.0 interfaces. This compact system solution provides a significant reduction in board size over TI?s previous solutions. In addition, the TNETW1450 solution meets the highest level of industry standards, including Wi-Fi Protected Access 2 (WPA2) and WHQL, Wi-Fi and USB-IF certification. TI also introduced the 802.11 a/b/g compatible TNETW1350A MAC and BB processor, which provides on-chip power conversion and regulation, without external filters, reducing component count and bill of materials (BOM) by 50 percent.
These solutions easily pair with TI?s portfolio of flexible radios which offer a full range of performance options. For instance, when coupled with the TNETW1350A solution, the TNETW3422/28 extended range, high output power radio offers up to two times the range of existing solutions at a fraction of the cost.
In addition, the latest solutions feature TI?s 125Mbps equivalent G++ Mode, enabling throughput up to 36Mpbs.
TI?s TNETV1060
TI's TNETV1060 VoIP gateway solution, a complete integrated software and silicon system-on-a-chip, provides all the processing power needed for current and evolving VoIP standards as well as for implementing advanced functionality. The solution integrates TI?s programmable TMS320C55x? generation of DSPs, a MIPS32? 4KEc? processor, and field-proven Telogy Software? for VoIP. The TNETV1060 also features unique expansion capabilities that allow customers to scale their gateway products to larger business applications requiring additional channels of voice.
Availability
Z-Com?s XG-750 USB adapter and the P-1050 are being shipped to leading RG manufacturers worldwide as of Q2 2005. Z-Com?s RG module will be available in Q3 2005.
Texas Instruments Broadband Solutions
For OEMs developing broadband communications solutions, TI's advanced signal processing-based silicon and software platforms deliver the optimal performance, lower power consumption, and system-level integration required to rapidly deploy differentiated next-generation products for cable modems, digital subscriber line (xDSL) modems, integrated access devices (IADs), VoIP gateways, carrier infrastructure, and home and office wireless networking. See http://www.ti.com/broadband.
About Texas Instruments
Texas Instruments Incorporated provides innovative DSP and analog technologies to meet our customers' real world signal processing requirements. In addition to Semiconductor, the company's businesses include Sensors & Controls, and Educational & Productivity Solutions. TI is headquartered in Dallas, Texas, and has manufacturing, design or sales operations in more than 25 countries.
Texas Instruments is traded on the New York Stock Exchange under the symbol TXN. More information is located on the World Wide Web at http://www.ti.com.
About Z-Com Inc.
Z-Com Inc., established in 1995, develops, manufactures, and markets a series of high-performance local/wide area wireless data products and solutions for wireless Internet access and various mobile data applications. Z-Com?s headquarter and manufacturing facilities are located in Science-Based Industrial Park, Hsinchu, Taiwan with sales subsidiaries in Cerritos, CA, Rockaway, NJ, and London, England. Together with Taiwan?s strength in product engineering and competitive manufacturing, Z-Com has formed a valuable network of resources with expertise in communication system engineering, radio technology, protocol engineering, networking technologies, and manufacturing capabilities among others. See http://www.zcom.com.tw.
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Jun 30, 2005
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